Pharmaceutical R&D - Small to Medium Scale Compression
MODUL P Tablet Press
MODUL P 'ECM' technology with advanced dual control for R&D and small to medium production for single & bi-layer tableting.
Small-scale Production
The MODUL P features the unique Exchange Compression Module (ECM) for standard and high containment applications. The ECM encloses all product-contact parts in a sealed unit and can quickly and easily be removed from the machine in a contained manner for cleaning and replaced with a pre-prepared unit to allow production to resume in 30 minutes.
Small-scale Continuous Bi-layer Tablet Production
The MODUL P is also available with an Exchangeable Compression Module (ECM) for bi-layer tablet production. The MODUL P with bi-layer ECM is the first press to enter the market that enables continuous bi-layer tableting on a small scale. It is the perfect solution to your bi-layer formulation development, clinical trial and other small-scale production needs.
Features
- Standard or Wash-off-Line ECM
- Single and bi-layer capabilities in dust-tight and washable execution
- Choice of different compression modes (force control, dual control and advanced dual control)
- High sensitivity weight control for small tablets and those requiring low compression forces
- Dual reject feature
- Latest HMI for complete process control, including peripherals, for lights-out operation.
Benefits
- Fast product changeover, improved productivity and a safe working environment.
- Extended dwell time at pre- and main compression without any loss of linear speed.
- Individual control of tablet hardness.
- Flexible operation for small-medium. production and R&D operations with seamless scale-up.
- Medium throughput of up to 244.800 tablets/h.
Technical Specifications
The MODUL P is available for D, B, BB and BBS tooling:
| Tooling | D | B | BB | BBS |
| EU / TSM | EU / TSM | EU / TSM | EU / TSM | |
| Max. tablet diameter [mm] | 25,4 | 16 (L=19) | 13 (L=14,3) | 11 |
| Punch body diameter [mm] | 25,4 | 19 | 19 | 19 |
| Outside die diameter [mm] | 38,1 | 30,16 | 24 | 22 |
| Die height [mm] | 23,81 | 22,22 | 22,22 | 22,22 |
| Number of stations | 21 | 26 | 31 | 34 |
| Max. fill depth [mm] | 20 | 19 | 19 | 19 |
| Top punch penetration [mm] | 1 to 4 | |||
| Max. pre-compression force [kN] | 10 | |||
| Max. main compression force [kN] | 80 | |||
| Max. output capacity [tab/h] | 126.000 | 187.000 | 223.000 | 244.800 |
| Electrical requirements | 3phase+PE – 380 / 400 / 415 / 460 / 480 V – 50Hz / 60Hz
(nominal consumption 6 kW; power installed 11,9 kVA) | |||
| Compressed air requirements | clean & dry / 7-8 bar / 500l/m | |||
| Dust extraction requirements | 150 m³/h at 15 mbar | |||
| Machine dimensions & weight | W = 1.030 mm x D = 1.555 mm x H = 2.170 m – 2.500 kg | |||
Bi-Layer Capability
A bi-layer ECM is available for the MODUL P, adding to the versatility of the smallest machine in the MODUL range.
Features & Benefits
The MODUL P with bi-layer ECM:
- Enables continuous bi-layer tablet compression with a fully tooled turret.
- Is able to produce over 80.000 bi-layer tablets/hour.
- Can run with only one punch position in use, minimizing the tooling investment cost, as well as the powder quantities required for R&D.
- Is available with mixed turret (10 B and 10 D stations).
- Is available in WOL execution for working with highly potent substances.
Technical Specifications
The MODUL P with dedicated bi-layer ECM is available for the following tooling sizes:
| Tooling | D | B | BB | BBS |
| EU / TSM | EU / TSM | EU / TSM | EU / TSM | |
| Max. tablet diameter [mm] | 25,4 | 16 (L=19) | 13 (L=14,3) | 11 |
| Punch body diameter [mm] | 25,4 | 19 | 19 | 19 |
| Outside die diameter [mm] | 38,1 | 30,16 | 24 | 22 |
| Die height [mm] | 23,81 | 22,22 | 22,22 | 22,22 |
| Number of stations | 21 | 26 | 31 | 34 |
| Max. fill depth [mm] | 20 | 19 | 19 | 19 |
| Top punch penetration 2nd layer [mm] | 9 | |||
| Max. pre-compression force [kN] | 2,5 | |||
| Max. main compression force [kN] | 80 | |||
| Max. output capacity [tab/h] | 37.800 | 62.400 | 74.400 | 81.600 |
| Electrical requirements | 3phase+PE – 380 / 400 / 415 / 460 / 480 V – 50Hz / 60Hz
(nominal consumption 6 kW; power installed 11,9 kVA) | |||
| Compressed air requirements | clean & dry / 7-8 bar / 500l/m | |||
| Dust extraction requirements | 150 m³/h at 15 mbar | |||
| Machine dimensions & weight | W = 1.030 mm x D = 1.555 mm x H = 2.170 m – 2.500 kg | |||
Downloads
Prodotti correlati
PharmaConnect® R&D Processing
PharmaConnect® allows a number of diverse process modules to be docked to one control unit, including high shear granulation, pelletization and blending, coating.
Lavorazione R&D su letto fluido di prodotti farmaceutici
Con una serie completa di tecnologie per le attività di ricerca e sviluppo progettata per applicazioni specifiche, la nostra gamma di piccola taglia copre ogni aspetto della produzione di forme di dosaggio solido orale, dai miscelatori ad alta azione di taglio, gli essiccatori a letto fluido, i sistemi single-pot, agli estrusori e sferonizzatori,...
MODUL Tablet Press Technology
All MODUL tablet presses are based on the Exchangeable Compression Module (ECM) concept. The ECM is completely isolated from the remainder of the machine, contains all product contact parts and can easily be removed from the press in a contained way. This means that the press itself remains powder-free and requires no cleaning.
MODUL S Tablet Press
Thanks to the ECM (Exchangeable Compression Module), the MODUL S for medium-volume tablet production enables extremely fast change-over and offers unparalleled operator protection. All product contact parts are contained in an ISOLATED DUST-TIGHT module, which can be disconnected and removed from the machine in a contained manner, leaving the tab...
Approfondimenti GEA
Il nuovo impianto di pompe in Polonia ridefinisce la produzione igienica
Lo stabilimento GEA di Koszalin, in Polonia, rappresenta un punto di riferimento nella produzione di pompe sanitarie. Il sito multifunzionale combina decenni di esperienza ingegneristica tedesca con soluzioni scalabili e digitalizzazione...
